Hybridization Services

FLIP-CHIP PROCESS PARAMETERS
Wafer size
Ø 50 – 200 mm
For bumping and under bump metallization
Bump metal
Indium
Bump pitch (min)
15 µm
Bump dimensions
Ø 8 – 20 µm
height 5 – 12 µm
Chip size (max)
50 mm x 50 mm
Bonding types
Cold compression
Thermal compression
Reflow
Max force 100 kg
< 100°C
< 200°C (onesided indium bumping)
Bonding accuracy
+/- 2 µm